Product Title BEST BST-082 4 in 1 CPU BGA Reballing Stencil Planting Tin Plate for iPhone 13 Series
SKU STE56126
Image STE56126 STE56126 STE56126 STE56126 STE56126 STE56126 STE56126
Provider SkyStarTrade
URL https://www.skystartrade.com/product/1022764
Ship From California, US / HongKong 
Selling Price $11.99
Category Repair Tools > BGA IC Reballing Stencil
Compatible Devices & Models
iPhone 13 (A2482, A2631, A2633, A2634, A2635)
iPhone 13 Pro (A2483, A2636, A2638, A2639, A2640)
iPhone 13 Pro Max (A2484, A2641, A2643, A2644, A2645)
Product Description

1. Semi-etching process
2. Cooling hole desian
3. Square hole, precise alignment
4.The rounded square and precise hole position make the tin ball more rounded and prevents the mesh from jamming the tin ball
5. High temperature resistant, not easy to deform, non-sticky, easy to get off the net